OAS

 

Ministerial Declaration on trade in Information Technology Products

Singapore, 13 December 1996

Attachment A, Section 2

Semiconductor manufacturing and testing equipment and parts thereof

  HSCode Description Comments
ex 7017 10 Quartz reactor tubes and holders designed for insertion into diffusion and oxidation furnaces for production of semiconductor wafers For Attachment B
ex 8419 89 Chemical vapor deposition apparatus for semiconductor production For Attachment B
ex 8419 90 Parts of chemical vapor deposition apparatus for semiconductor production For Attachment B
ex 8421 19 Spin dryers for semiconductor wafer processing  
ex 8421 91 Parts of spin dryers for semiconductor wafer processing  
ex 8424 89 Deflash machines for cleaning and removing contaminants from the metal leads of semiconductor packages prior to the electroplating process  
ex 8424 89 Spraying appliances for etching, stripping or cleaning semiconductor wafers  
ex 8424 90 Parts of spraying appliances for etching, stripping or cleaning semiconductor wafers  
ex 8456 10 Machines for working any material by removal of material, by laser or other light or photo beam in the production of semiconductor wafers  
ex 8456 91 Apparatus for stripping or cleaning semiconductor wafers For Attachment B
  8456 91 Machines for dry­etching patterns on semiconductor materials  
ex 8456 99 Focused ion beam milling machines to produce or repair masks and reticles for patterns on semiconductor devices  
ex 8456 99 Lasercutters for cutting contacting tracks in semiconductor production by laser beam For Attachment B
ex 8464 10 Machines for sawing monocrystal semiconductor boules into slices, or wafers into chips For Attachment B
ex 8464 20 Grinding, polishing and lapping machines for processing of semiconductor wafers  
ex 8464 90 Dicing machines for scribing or scoring semiconductor wafers  
ex 8466 91 Parts for machines for sawing monocrystal semiconductor boules into slices, or wafers into chips For Attachment B
ex 8466 91 Parts of dicing machines for scribing or scoring semiconductor wafers For Attachment B
ex 8466 91 Parts of grinding, polishing and lapping machines for processing of semiconductor wafers  
ex 8466 93 Parts of focused ion beam milling machines to produce or repair masks and reticles for patterns on semiconductor devices  
ex 8466 93 Parts of lasercutters for cutting contacting tracks in semiconductor production by laser beam For Attachment B
ex 8466 93 Parts of machines for working any material by removal of material, by laser or other light or photo beam in the production of semiconductor wafers  
ex 8456 93 Parts of apparatus for stripping or cleaning semiconductor wafers For Attachment B
ex 8466 93 Parts of machines for dry­etching patterns on semiconductor materials  
ex 8477 10 Encapsulation equipment for assembly of semiconductors For Attachment B
ex 8477 90 Parts of encapsulation equipment For Attachment B
ex 8479 50 Automated machines for transport, handling and storage of semiconductor wafers, wafer cassettes, wafer boxes and other material for semiconductor devices For Attachment B
ex 8479 89 Apparatus for growing or pulling monocrystal semiconductor boules  
ex 8479 89 Apparatus for physical deposition by sputtering on semiconductor wafers For Attachment B
ex 8479 89 Apparatus for wet etching, developing, stripping or cleaning semiconductor wafers and flat panel displays For Attachment B
ex 8479 89 Die attach apparatus, tape automated bonders, and wire bonders for assembly of semiconductors For Attachment B
ex 8479 89 Encapsulation equipment for assembly of semiconductors For Attachment B
ex 8479 89 Epitaxial deposition machines for semiconductor wafers  
ex 8479 89 Machines for bending, folding and straightening semiconductor leads For Attachment B
ex 8479 89 Physical deposition apparatus for for semiconductor production For Attachment B
ex 8479 89 Spinners for coating photographic emulsions on semiconductor wafers For Attachment B
ex 8479 90 Part of apparatus for physical deposition by sputtering on semiconductor wafers For Attachment B
ex 8479 90 Parts for die attach apparatus, tape automated bonders, and wire bonders for assembly of semiconductors For Attachment B
ex 8479 90 Parts for spinners for coating photographic emulsions on semiconductor wafers For Attachment B
ex 8479 90 Parts of apparatus for growing or pulling monocrystal semiconductor boules  
ex 8479 90 Parts of apparatus for wet etching, developing, stripping or cleaning semiconductor wafers and flat panel displays For Attachment B
ex 8479 90 Parts of automated machines for transport, handling and storage of semiconductor wafers, wafer cassettes, wafer boxes and other material for semiconductor devices For Attachment B
ex 8479 90 Parts of encapsulation equipment for assembly of semiconductors For Attachment B
ex 8479 90 Parts of epitaxial deposition machines for semiconductor wafers  
ex 8479 90 Parts of machines for bending, folding and straightening semiconductor leads For Attachment B
ex 8479 90 Parts of physical deposition apparatus for for semiconductor production For Attachment B
ex 8480 71 Injection and compression moulds for the manufacture of semiconductor devices  
ex 8514 10 Resistance heated furnaces and ovens for the manufacture of semiconductor devices on semiconductor wafers  
ex 8514 20 Inductance or dielectric furnaces and ovens for the manufacture of semiconductor devices on semiconductors wafers  
ex 8514 30 Apparatus for rapid heating of semiconductor wafers For Attachment B
ex 8514 30 Parts of resistance heated furnaces and ovens for the manufacture of semiconductor devices on semiconductor wafers  
ex 8514 90 Parts of apparatus for rapid heating of wafers For Attachment B
ex 8514 90 Parts of furnaces and ovens of Headings No 8514 10 to No 8514 30  
ex 8536 90 Wafer probers For Attachment B
  8543 11 Ion implanters for doping semiconductor materials  
ex 8543 30 Apparatus for wet etching, developing, stripping or cleaning semiconductor wafers and flat panel displays For Attachment B
ex 8543 90 Parts of apparatus for wet etching, developing, stripping or cleaning semiconductor wafers and flat panel displays For Attachment B
ex 8543 90 Parts of ion implanters for doping semiconductor materials  
  9010 41 to 9010 49 Apparatus for projection, drawing or plating circuit patterns on sensitized semiconductor materials and flat panel displays  
ex 9010 90 Parts and accessories of the apparatus of Headings No 9010 41 to 9010 49  
ex 9011 10 Optical stereoscopic microscopes fitted with equipment specifically designed for the handling and transport of semiconductor wafers or reticles For Attachment B
ex 9011 20 Photomicrographic microscopes fitted with equipment specifically designed for the handling and transport of semiconductor wafers or reticles For Attachment B
ex 901190 Parts and accessories of optical stereoscopic microscopes fitted with equipment specifically designed for the handling and transport of semiconductor wafers or reticles For Attachment B
ex 9011 90 Parts and accessories of photomicrographic microscopes fitted with equipment specifically designed for the handling and transport of semiconductor wafers or reticles For Attachment B
ex 9012 10 Electron beam microscopes fitted with equipment specifically designed for the handling and transport of semiconductor wafers or reticles For Attachment B
ex 9012 90 Parts and accessories of electron beam microscopes fitted with equipment specifically designed for the handling and transport of semiconductor wafers or reticles For Attachment B
ex 9017 20 Pattern generating apparatus of a kind used for producing masks or reticles from photoresist coated substrates For Attachment B
ex 9017 90 Parts and accessories for pattern generating apparatus of a kind used for producing masks or reticles from photoresist coated substrates For Attachment B
ex 9017 90 Parts of such pattern generating apparatus For Attachment B
  9030 82 Instruments and apparatus for measuring or checking semiconductor wafers or devices  
ex 9030 90 Parts and accessories of instruments and apparatus for measuring or checking semiconductor wafers or devices  
ex 9030 90 Parts of instruments and appliances for measuring or checking semiconductor wafers or devices  
  9031 41 Optical instruments and appliances for inspecting semiconductor wafers or devices or for inspecting masks, photomasks or reticles used in manufacturing semiconductor devices  
ex 9031 49 Optical instruments and appliances for measuring surface particulate contamination on semiconductor wafers  
ex 9031 90 Parts and accessories of optical instruments and appliances for inspecting semiconductor wafers or devices or for inspecting masks, photomasks or reticles used in manufacturing semiconductor devices  
ex 9031 90 Parts and accessories of optical instruments and appliances for measuring surface particulate contamination on semiconductor wafers  


Positive list of specific products to be covered by this agreement wherever they are classified in the HS. Where parts are specified, they are to be covered in accordance with HS Notes 2(b) to Section XVI and Chapter 90, respectively.

Computers: automatic data processing machines capable of

  1. storing the processing program or programs and at least the data immediately necessary for the execution of the program;
  2. being freely programmed in accordance with the requirements of the user;
  3. performing arithmetical computations specified by the user; and
  4. executing, without human intervention, a processing program which requires them to modify their execution, by logical decision during the processing run.

The agreement covers such automatic data processing machines whether or not they are able to receive and process with the assistance of central processing unit telephony signals, television signals, or other analogue or digitally processed audio or video signals. Machines performing a specific function other than data processing, or incorporating or working in conjunction with an automatic data processing machine, and not otherwise specified under Attachment A or B, are not covered by this agreement.

Electric amplifiers when used as repeaters in line telephony products falling within this agreement, and parts thereof
Flat panel displays (including LCD, Electro Luminescence, Plasma and other technologies) for products falling within this agreement, and parts thereof.
Network equipment: Local Area Network (LAN) and Wide Area Network (WAN) apparatus, including those products dedicated for use solely or principally to permit the interconnection of automatic data processing machines and units thereof for a network that is used primarily for the sharing of resources such as central processor units, data storage devices and input or output units ­ including adapters, hubs, in­line repeaters, converters, concentrators, bridges and routers, and printed circuit assemblies for physical incorporation into automatic data processing machines and units thereof.
Monitors: display units of automatic data processing machines with a cathode ray tube with a dot screen pitch smaller than 0,4 mm not capable of receiving and processing television signals or other analogue or digitally processed audio or video signals without assistance of a central processing unit of a computer as defined in this agreement.

The agreement does not, therefore, cover televisions, including high definition televisions.

Optical disc storage units, for automatic data processing machines (including CD drives and DVD­drives), whether or not having the capability of writing/recording as well as reading, whether or not in their own housings.
Paging alert devices , and parts thereof.
Plotters whether input or output units of HS heading No 8471 or drawing or drafting machines of HS heading No 9017.
Printed Circuit Assemblies for products falling within this agreement, including such assemblies for external connections such as cards that conform to the PCMCIA standard.

Such printed circuit assemblies consist of one or more printed circuits of heading 8534 with one or more active elements assembled thereon, with or without passive elements "Active elements" means diodes, transistors, and similar semiconductor devices, whether or not photosensitive, of heading 8541, and integrated circuits and micro assemblies of heading 8542.

Projection type flat panel display units used with automatic data processing machines which can display digital information generated by the central processing unit.
Proprietary format storage devices including media therefor for automatic data processing machines, with or without removable media and whether magnetic, optical or other technology, including Bernoulli Box, Syquest, or Zipdrive cartridge storage units.
Multimedia upgrade kits for automatic data processing machines, and units thereof, put up for retail sale, consisting of, at least, speakers and/or microphones as well as a printed circuit assembly that enables the ADP machines and units thereof to process audio signals (sound cards).
Set top boxes which have a communication function : a microprocessor­based device incorporating a modem for gaining access to the Internet, and having a function of interactive information exchange.